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ST72324BJ2 bảng dữ liệu(PDF) 171 Page - STMicroelectronics

tên linh kiện ST72324BJ2
Giải thích chi tiết về linh kiện  8-bit MCU, 3.8 to 5.5 V operating range with 8 to 32 Kbyte Flash/ROM, 10-bit ADC, 4 timers, SPI, SCI
PDF  188 Pages
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
Trang chủ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST72324BJ2 bảng dữ liệu(HTML) 171 Page - STMicroelectronics

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ST72324B
Package characteristics
171/188
13.5
Thermal characteristics
13.6
Soldering information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
Table 117.
Thermal characteristics
Symbol
Ratings
Value
Unit
RthJA
Package thermal resistance (junction to ambient):
LQFP44 10x10
LQFP32 7x7
DIP42 600mil
SDIP32 200mil
52
70
55
50
°C/W
PD
Power dissipation(1)
1.
The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation
of an application can be defined by the user with the formula: PD =PINT +PPORT where PINT is the chip
internal power (IDD x VDD) and PPORT is the port power dissipation depending on the ports used in the
application.
500
mW
TJmax
Maximum junction temperature(2)
2.
The maximum chip-junction temperature is based on technology characteristics.
150
°C



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