23

MARCH 1994 - REVISED MARCH 2000

TISP7125F3, TISP7150F3, TISP7180F3, TISP7240F3, TISP7260F3,

TISP7290F3, TISP7320F3, TISP7350F3, TISP7380F3

TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS

P R O D UCT

INFORM A T ION

MECHANICAL DATA

P008

plastic dual-in-line package

This dual-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic

compound. The compound will withstand soldering temperature with no deformation, and circuit performance

characteristics will remain stable when operated in high humidity conditions The package is intended for

insertion in mounting-hole rows on 7,62 (0.300) centres. Once the leads are compressed and inserted,

sufficient tension is provided to secure the package in the board during soldering. Leads require no additional

cleaning or processing when used in soldered assembly.

ALL LINEAR DIMENSIONS IN MILLIMETERS AND PARANTHETICALLY IN INCHES

0,53 (0.021)

0,38 (0.015)

8Places

1,78 (0.070) MAX

4Places

6,60 (0.260)

6,10 (0.240)

P008

8,23 (0.324)

7,62 (0.300)

9,75 (0.384)

9,25 (0.364)

2,54 (0.100) Typical

(see Note A)

6Places

5,08 (0.200)

MAX

3,17 (0.125)

MIN

0,51 (0.020)

MIN

3

12

4

87

6

5

Seating

Plane

9,40 (0.370)

8,38 (0.330)

0,36 (0.014)

0,20 (0.008)

NOTES: A. Each pin centreline is located within 0,25 (0.010) of its true longitudinal position.

B. Dimensions fall within JEDEC MS001 - R-PDIP-T, 0.300" Dual-In-Line Plastic Family.

C. Details of the previous dot index P008 package style, drawing reference MDXXABA, are given in the earlier publications.

MDXXCF

Index

Notch