PACKAGE INFORMATION

PE-WLCSP-6-P1-0606

RECOMMENDED LAND PATTERN (WLCSP)

NSMD

Solder Mask

(resist)

Copper Pad

Substrate

SMD

（

Unit : mm）

NSMD and SMD Pad Definition

Pad definition

Copper Pad

Solder Mask Opening

NSMD (Non-Solder Mask defined)

0.20mm

Min. 0.30mm

SMD (Solder Mask defined)

Min. 0.30mm

0.20mm

*

Pad layout and size can be modified by customers material, equipment, method.

*

Please adjust pad layout according to your conditions.

*

Recommended Stencil Aperture Size....ø0.3mm

*

Since lead free WL-CSP components are not compatible with the tin/lead solder process, you shall not mount lead free WL-CSP

components using the tin/lead solder paste.