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R1182K291D bảng dữ liệu(PDF) 21 Page - RICOH electronics devices division |
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R1182K291D bảng dữ liệu(HTML) 21 Page - RICOH electronics devices division |
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21 / 23 page ![]() PACKAGE INFORMATION PE-PLP1616-6-0606 POWER DISSIPATION (PLP1616-6) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: (PLP1616-6 is a reference value calculated from the PLP1820-6 package.) Measurement Conditions Standard Land Pattern Environment Mounting on Board (Wind velocity=0m/s) Board Material Glass cloth epoxy plactic (Double sided) Board Dimensions 40mm × 40mm × 1.6mm Copper Ratio Top side : Approx. 50% , Back side : Approx. 50% Through-hole φ0.54mm × 30pcs Measurement Result (Topt=25 °C,Tjmax=125°C) Standard Land Pattern Power Dissipation 560mW Thermal Resistance θja=(125−25°C)/0.56W=179°C/W 0 50 100 25 75 85 125 150 Ambient Temperature ( °C) 0 200 100 300 400 560 500 On Board 600 40 Measurement Board Pattern Power Dissipation IC Mount Area Unit : mm RECOMMENDED LAND PATTERN 0.35 0.225 0.125 0.90 0.50 0.25 (Unit: mm) |
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