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CYIS1SM0250-AA
Document Number: 38-05713 Rev. *B
Page 20 of 24
Die Alignment
Figure 13. Die Alignment
The die is aligned manually in the package to a tolerance of ±50
µm and the alignment is verified after hardening the die adhesive.
All dimensions in figure 13 are in mm.
Die Adhesive:
0.08+0.02
Window Adhesive:
0.08+0.02
Glass Window:
1.0+/-0.05
Die:
0.508+0.01
Bonding Cavity:
0.508+0.051
Die Cavity:
0.508+0.051
Section A
A -
Drawing Not to Scale
68
Center of Cavity
and of FPA
Center of
Silicium
Offset Between Center of
Silicium and Center of
Cavity:
X: 0
Y: 68 m
Parallelism in
X and Y within
+ 50 m
Pin 1
A
A
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