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82546EB bảng dữ liệu(PDF) 39 Page - Intel Corporation |
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82546EB bảng dữ liệu(HTML) 39 Page - Intel Corporation |
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39 / 47 page ![]() Networking Silicon — 82546EB Datasheet 33 5.3 Thermal Specifications The 82546EB device is specified for operation when the ambient temperature (TA) is within the range of 0 C to 55 C. The maximum permitted junction temperature is 120 C. TC (case temperature) is calculated using the equation: TC = TA + P (qJA - q JC) TJ (junction temperature) is calculated using the equation: TJ = TA + P qJA The power consumption (P) is calculated by using the typical ICC and nominal VCC. The thermal resistances are shown in Table 21. Thermal resistances are determined empirically with test devices mounted on standard thermal test boards. Real system designs may have different characteristics due to board thickness, arrangement of ground planes, and proximity of other components. The case temperature measurements should be used to assure that the 82546EB device is operating under recommended conditions. Table 21. Thermal Characteristics Symbol Parameter Value at specified airflow (m/s) Units 01 23 qJA Thermal resistance, junction-to- ambient 17.7 15.6 14.8 14.0 C/Watt qJC Thermal resistance, junction-to- case 6.8 6.8 6.8 6.8 C/Watt |
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