19

Reflow-soldering profile

The Teseo-LIV3FL is a high temperature strength surface that mounts the GNSS module supplied on an 18 pin,

6-layer PCB. The final assembly recommended that reflows profiles is indicated here below.

Soldering phase has to be executed with care in order to avoid undesired melting phenomena. Particular attention

has to be taken on the setup of the peak temperature.

Here below some suggestions for the temperature profile based on the following recommendations.

Table 12. Soldering profile values

Profile feature

PB-free assembly

Average ramp-up rate (TSMAX to Tp)

3 °C/s max.

Preheat:

•

Temperature min (TSmin)

•

Temperature max (TSmax)

•

Time (tSmin to tSmax) (tS)

150 °C

200 °C

60-100 s

Time maintained above:

•

Temperature (TL)

•

Time (tL)

217° C

60-70 s

Peak temperature (TP)

245 ±5 °C

Time within 5 °C of actual peak temperature (TP)

10-20 s

Ramp-down rate

4 °C/s

Time from 25 °C to peak temperature

8 minute max.

Figure 10. Soldering profiles

19.1

Cooling phase

A controlled cooling avoids negative metallurgical effects of the solder (solder becomes more brittle) and possible

mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets with a good shape

and low contact angle.

Temperature fall rate: max 4 °C/s

To avoid falling off, the Teseo module should be placed on the topside of the motherboard during soldering.

Teseo-LIV3FL

Reflow-soldering profile

DS13881 - Rev 4

page 26/34