5.4 Thermal Information

THERMAL METRIC(1)

LPV521

UNIT

DCK (SC70)

P (PDIP)

5 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance(2)

456

102.3

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

53.9

81.2

°C/W

RθJB

Junction-to-board thermal resistance

48.9

64.9

°C/W

ψJT

Junction-to-top characterization parameter

6.6

47.6

°C/W

ψJB

Junction-to-board characterization parameter

48.3

64.1

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance

N/A

N/A

°C/W

(1)

For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature

is PD = (TJ(MAX) – TA) / θJA. All numbers apply for packages soldered directly onto a PCB.

5.5 Electrical Characteristics

at TA = 25°C, V+ = 1.8V, 3.3V, and 5V, V– = 0V, VCM = VO = VS / 2, and RL > 1 MΩ (unless otherwise noted)(1)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

OFFSET VOLTAGE

VOS

Input offset voltage

VCM = V– + 0.3V

–1

0.1

1

mV

TA = –40°C to +125°C

–1.23

1.23

VCM = V+ – 0.3V

–1

0.1

1

TA = –40°C to +125°C

–1.23

1.23

TCVOS

Input offset voltage drift(2)

±0.4

µV/°C

TA = –40°C to +125°C

V+ = 1.8V, 3.3V

–3

3

V+ = 5V

–3.5

3.5

PSRR

Power-supply rejection

ratio

1.6V ≤ V+ ≤ 5.5V,

VCM = 0.3V

85

109

dB

TA = –40°C to +125°C

76

INPUT BIAS CURRENT

IBIAS

Input bias current

V+ = 1.8V, 3.3V

–1

0.01

1

pA

V+ = 5V

–1

0.04

1

TA = –40°C to +125°C

–50

+50

IOS

Input offset current

V+ = 1.8V

10

fA

V+ = 3.3V

20

V+ = 5V

60

NOISE

Input-referred voltage

noise

V+ = 1.8V

24

µVPP

V+ = 3.3V, 5V

22

en

Input-referred voltage

noise density

f = 100Hz

V+ = 1.8V

265

nV/√Hz

V+ = 3.3V

259

V+ = 5V

255

in

Input-referred current

noise

f = 100Hz

100

fA/√Hz

LPV521

SNOSB14E – AUGUST 2009 – REVISED JULY 2024

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