S32K311NHT0MPAST datasheet(21/152 Pages) NXP

21 / 152 page

Table 2. Absolute maximum ratings (continued)

Symbol

Description

Min

Typ

Max

Unit

Condition

Spec

Number

V11

High-current core

logic supply input 2

-0.3

—

1.26

For S32K388 and

S32K389

—

V11

Core logic

voltage supply

(1.1 V), internally

regulated 2

-0.3

—

1.26

For all S32K3xx

variants except

S32K388 and S32K389

—

VREFH

ADC high reference

voltage 1,2

-0.3

—

6.0

—

VREFL

ADC low reference

voltage 2

-0.3

—

0.3

—

VGPIO_trans

Transient

overshoot voltage

allowed on I/

O pin 1,2,4

—

6.0

—

I_INJPAD_DC_

ABS

Continuous DC

input current

(positive/negative)

that can be injected

into an I/O pin 5

-3

—

I_INJSUM_DC_

ABS

Sum of absolute

value of injected

currents on all the

I/O pins (continuous

DC limit) 5,6

—

TSTG

Storage ambient

temperature 7

-55

—

150

°C

—

1. 6.0 V maximum for 10 hours over lifetime; 7.0 V maximum for 60 seconds over lifetime.

2. All voltages are referred to VSS unless otherwise specified.

3. Voltage at VDD_DCDC cannot be higher than VDD_HV_A.

4. When a low impedance voltage source, without current limitation, is connected to one or more I/O pins, the VGPIO_trans

absolute max rating must be honored. During current injection, the voltage at the I/O pin or pins could go beyond this limit if

(and ONLY IF) the injected current is being limited (I_INJPAD_DC_ABS is respected).

5. When the input pad voltage levels are close to VDD_HV_A (respectively to VDD_HV_B) or VSS, plus /minus the forward

voltage of ESD diodes, practically, no current is being injected. When these limits are exceeded, the maximum input

current spec must be met. See S32K3 Hardware Design Guidelines for more details and recommendations for protecting

the devices against injection current.

6. If a positive injection current is present in one or more I/O pins when the device is in Low Speed RUN or STANDBY mode,

the voltage in the respective I/O power domain (VDD_HV_A or VDD_HV_B) would increase and may cause damage to the

MCU. It is recommended to add external circuitry (which are explained in the S32K3XX Hardware Design Guidelines) to

protect the MCU against injection current.

7. TSTG specifies the storage temperature range. It is not the operating temperature range. Please refer to the Thermal

operating characteristics table.

NXP Semiconductors

General

S32K3xx Data Sheet, Rev. 10, 07/2024

Data Sheet: Technical Data

Preliminary Information for S32K389

21 / 152

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