19

LT1028/LT1128

S Package

16-Lead Plastic Small Outline (Narrow .150 Inch)

(Reference LTC DWG # 05-08-1610)

H Package

3-Lead TO-39 Metal Can

(Reference LTC DWG # 05-08-1330)

PACKAGE DESCRIPTIO

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

0.050

(1.270)

MAX

0.016 – 0.021**

(0.406 – 0.533)

0.010 – 0.045*

(0.254 – 1.143)

SEATING

PLANE

0.040

(1.016)

MAX

0.165 – 0.185

(4.191 – 4.699)

GAUGE

PLANE

REFERENCE

PLANE

0.500 – 0.750

(12.700 – 19.050)

0.305 – 0.335

(7.747 – 8.509)

0.335 – 0.370

(8.509 – 9.398)

DIA

0.230

(5.842)

TYP

0.027 – 0.045

(0.686 – 1.143)

0.028 – 0.034

(0.711 – 0.864)

0.110 – 0.160

(2.794 – 4.064)

INSULATING

STANDOFF

45

°TYP

H8 (TO-5) 0.230 PCD 1197

LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE

AND 0.045" BELOW THE REFERENCE PLANE

FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS

0.016 – 0.024

(0.406 – 0.610)

*

**

PIN 1

0.016 – 0.050

(0.406 – 1.270)

0.010 – 0.020

(0.254 – 0.508)

× 45°

0

° – 8° TYP

0.008 – 0.010

(0.203 – 0.254)

1

2

3

4

5

6

7

8

0.150 – 0.157**

(3.810 – 3.988)

16

15

14

13

0.386 – 0.394*

(9.804 – 10.008)

0.228 – 0.244

(5.791 – 6.197)

12

11

10

9

S16 1098

0.053 – 0.069

(1.346 – 1.752)

0.014 – 0.019

(0.355 – 0.483)

TYP

0.004 – 0.010

(0.101 – 0.254)

0.050

(1.270)

BSC

DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE

DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE

*

**

OBSOLETE PACKAGE