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SL1ICS3001 bảng dữ liệu(PDF) 17 Page - NXP Semiconductors

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I•CODE1 Chip Specification
Rev. 2.1
May 2000
SL040521.doc/M
Public
Page 17 of 22
15 Inlet/Label Characterisation and Test
15.1 Characterisation of the Inlet/Label
The parameters recommended to be characterised for the inlet/label are:
Parameter
Symbol
Conditions
Resonant frequency
fres
Resonant frequency @ Tamb = 22 °C @ BTH
No command transmitted to the inlet/label
à
Label generates no response
à No modulation
Threshold value for
UNSELECTED READ command
(standard mode)
BTH
UNSELECTED READ command OK
Threshold value for WRITE command
(standard mode)
BWR
WRITE (and Verifying READ) command OK
15.2 Final Test of the Inlet/Label
Basic flow for production and test:
1. Production of wafer
2. Testing of dies on wafer
3. Writing of serial numbers and pre-configuration
4. Sawing of wafer
5. Assembly of inlets/labels
6. Final test of inlets/labels
7. Writing of customer data
To detect damage of EEPROM cells during production of inlets/labels a final test of the
EEPROM after assembly of the inlet/label is recommended. This is necessary to achieve
lowest failure rates.



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