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PACKAGE OUTLINE

C

2X 1.3

4X 0.65

10X (0.05)

6X 0.28

0.22

6X 0.54

0.46

1.6 MAX

4X 0.8 0.03

2X 1.75

4X 0.3 0.03

2X 0.9

2X 3.1

4X 0.79

0.71

4X 1.19

1.11

2X 1.15

2.4

B

3.1

2.9

A

4.1

3.9

(3.2)

(2.5)

4X (0.075)

uSIP - 1.6 mm max height

SIE0014A-C01

MICRO SYSTEM IN PACKAGE

4228828/B 10/2022

AREA

PIN 1 INDEX

NOTE 3

PICK AREA

0.08 C

0.1

C A B

0.05

C

1

10

SYMM

SYMM

5

6

11

12

13

14

(OPTIONAL)

PIN 1 ID

MicroSiP is a trademark of Texas Instruments

TM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Pick and place nozzle

1.3 mm or smaller recommended.

4. The package thermal pads must be soldered to the printed circuit board for thermal and mechanical performance.

0.1

C A B

0.05

C

SCALE 3.000

TPSM82816

SLUSEY7A – DECEMBER 2022 – REVISED JUNE 2024

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30

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