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MPX5010DP bảng dữ liệu(PDF) 2 Page - NXP Semiconductors |
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MPX5010DP bảng dữ liệu(HTML) 2 Page - NXP Semiconductors |
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2 / 32 page ![]() NXP Semiconductors MPX5010-MPXV5010-MPVZ5010 Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated 4 Ordering information Package Type number Name Description Version Unibody package (MPX5010 series) MPX5010DP SENSOR4F sensor package, 6 terminals, 2.54 mm pitch, 17.78 mm x 29.48 mm x 10.67 body SOT1756-1 MPX5010GP SENSOR6F sensor package, 6 terminals, 2.54 mm pitch, 17.78 mm x 29.47 mm x 8.01 mm body SOT1852-1 Small outline package (MPXV5010 series) MPXV5010DP S08 plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06. mm x 12.06 mm x 7.62 mm body SOT1693-1 MPXV5010GC6T1 S08 plastic, small outline package, 8 terminals, 2.54 mm pitch, 10.67. mm x 10.67 mm x 12.96 mm body SOT1854-1 MPXV5010GC7U S08 plastic, small outline package, 8 terminals, 2.54 mm pitch, 10.67. mm x 10.67 mm x 12.96 mm body SOT1863-1 MPXV5010GP S08 plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06. mm x 12.06 mm x 7.62 mm body SOT1693-3 Small outline package (Media resistant gel) (MPVZ5010 series) MPVZ5010GW6U S08 plastic, small outline package, 8 terminals, 2.54 mm pitch, 1.07 mm x 1.07 mm x 1.99 mm body SOT1691-2 MPVZ5010GW7U S08 plastic, small outline package, 8 terminals, 2.54 mm pitch, 1.07 mm x 1.07 mm x 1.99 mm body SOT1691-1 Table 1. Ordering information 4.1 Ordering options ORDERING INFORMATION # of Ports Pressure Type Device Name Case No. None Single Dual Gauge Differential Absolute Device Marking Unibody Package (MPX5010 Series) MPX5010DP 867C • • MPX5010DP MPX5010GP 867B • • MPX5010GP Small Outline Package (MPXV5010 Series) MPXV5010DP 1351 • • MPXV5010DP MPXV5010GC6T1 482A • • MPXV5010G MPXV5010GC7U 482C • • MPXV5010G MPXV5010GP 1369 • • MPXV5010GP Small Outline Package (Media Resistant Gel) (MPVZ5010 Series) MPVZ5010GW6U 1735 • • MZ5010GW MPVZ5010GW7U 1560 • • MZ5010GW Table 2. Ordering options MPX5010 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 14 — 17 May 2024 2 / 32 |
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