TMD26721 datasheet(37/44 Pages) OSRAM

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ams Datasheet

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[v1-00] 2015-Mar-23

TMD2672 − Soldering & Storage Information

Soldering Information

The module has been tested and has demonstrated an ability

to be reflow soldered to a PCB substrate. The process,

equipment, and materials used in these test are detailed below.

The solder reflow profile describes the expected maximum heat

exposure of components during the solder reflow process of

product on a PCB. Temperature is measured on top of

component. The components should be limited to a maximum

of three passes through this solder reflow profile.

Figure 46:

Solder Reflow Profile

Figure 47:

Solder Reflow Profile Graph

Parameter

Reference

Device

Average temperature gradient in preheating

2.5°C/sec

Soak time

tsoak

2 to 3 minutes

Time above 217°C (T1)t1

Max 60 sec

Time above 230°C (T2)t2

Max 50 sec

Time above Tpeak - 10°C (T3)t3

Max 10 sec

Peak temperature in reflow

Tpeak

260°C

Temperature gradient in cooling

Max -5°C/sec

Soldering & Storage

Information

tsoak

Tpeak

Not to scale — for reference only

Time (sec)

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