TMD2621 datasheet(51/59 Pages) OSRAM

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[v4-00] 2023-Apr-12

TMD2621 − Soldering & Storage Information

Figure 69:

Solder Reflow Profile Graph

Storage Information

Moisture Sensitivity Optical characteristics of the device can be

adversely affected during the soldering process by the release

and vaporization of moisture that has been previously

absorbed into the package. To ensure the package contains the

smallest amount of absorbed moisture possible, each device is

baked prior to being dry packed for shipping. Devices are dry

packed in a sealed aluminized envelope called a

moisture-barrier bag with silica gel to protect them from

ambient moisture during shipping, handling, and storage

before use.

Shelf Life

The calculated shelf life of the device in an unopened moisture

barrier bag is 24 months from the date code on the bag when

stored under the following conditions:

• Shelf Life: 24 months

• Ambient Temperature: <40°C

• Relative Humidity: <90%

Rebaking of the devices will be required if the devices exceed

the 24 months shelf life or the Humidity Indicator Card shows

that the devices were exposed to conditions beyond the

allowable moisture region.

Not to Scale – For Reference Only

Time (seconds)

TC - 5°C

Tsmin

Tsmax

Preheat Area

Max Ramp Up Rate = 3°C/s

Max Ramp Down Rate = 6°C/s

TMD2621 bảng dữ liệu(PDF) 51 Page - OSRAM GmbH