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ACT88321 bảng dữ liệu(PDF) 41 Page - Qorvo, Inc

tên linh kiện ACT88321
Giải thích chi tiết về linh kiện  Advanced PMIC with 3 Bucks, 2 LDOs, and Load Bypass Switches
PDF  55 Pages
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nhà sản xuất  QORVO [Qorvo, Inc]
Trang chủ  https://www.qorvo.com/
Logo QORVO - Qorvo, Inc

ACT88321 bảng dữ liệu(HTML) 41 Page - Qorvo, Inc

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ACT88321
Advanced PMIC with 3 Bucks, 2 LDOs, and Load Bypass Switches
Datasheet Rev. D , June 17, 2022 | Subject to change without notice
41 of 55
www.qorvo.com
®
PC Board Layout Guidance
Proper parts placement and PCB layout are critical to
the operation of switching power supplies. Follow the
following
layout
guidelines
when
designing
the
ACT88321 PCB. Refer to the Qorvo ACT88321
Evaluation Kits for layout examples
1.
Place the buck input capacitors as close as
possible to the IC. Connect the capacitors di-
rectly to the corresponding VIN_Bx input pin
and PGNDx power ground pin on the same
PCB layer as the IC. Avoid using vias.
2.
Minimize the switch node trace length between
each SW_Bx pin and the inductor. Avoid routing
sensitive analog signals near these high fre-
quency, high dV/dt traces.
3.
Place the LDO input capacitors close to their in-
put pins. Connect their ground pins into the
ground plane that connects the IC’s PGNDx
pins.
4.
The input capacitor and output capacitor
grounds should be connected as close together
as possible, with short, direct, and wide traces.
5.
Connect the PGNDx ground pins and the
AGND ground pin directly to the PGND under
the IC. The AGND ground plane should be
routed separately from the other ground planes
and only connect to the main ground plane un-
der the IC at the AGND pin.
6.
Connect the VIN input capacitor to the AGND
ground pin.
7.
Remember that all open drain outputs need
pullup resistors.
8.
Connect the PGND directly to the top layer
ground plane. Connect the top layer ground
plane to both internal ground planes and the
PCB backside ground plane with thermal vias.
Provide ground plane routing on multiple layers
that allows the IC’s heat to flow into the PCB
and then spread radially from the IC. Avoid cut-
ting the ground planes and adding vias that re-
strict the radial flow of heat of operating condi-
tions and are relatively insensitive to layout con-
siderations.



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