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CONNECTION DIAGRAMS

UCD7230

(HTSSOP)

UCD7230

(QFN -

RGW)

(5x5, 0.65)

17

16

15

14

13

12

4

5

6

7

8

9

3V3

AGND

DLY

I0

A0

OUT1

PVDD

OUT2

11

10

POS

PGND

ILIM

NEG

CLF

BST

18

3

IN

SW

4

2

3

10

15

14

13

12

3V3

AGND

DLY

ILIM

OUT1

BST

PVDD

19

18

17

16

1

7

8

9

SW

11 OUT2

6

5

CLF

20

2

1

19

20

SRE

VDD

CSBIAS

CS+

UCD7230

SLUS741C – NOVEMBER 2006 – REVISED MARCH 2007

PACKAGED DEVICES

TEMPERATURE RANGE

PowerPAD™ HTSSOP-20 (PWP)

QFN-20 (RGW)

-40°C to + 125°C

UCD7230PWP

UCD7230RGW

(1)

These products are packaged in Pb-Free and green lead finish of Pd-Ni-Au which is compatible with MSL level 1 at 255-260°C peak

reflow temperature to be compatible with either lead free or Sn/Pb soldering operations.

(2)

HTSSOP-20 (PWP), and QFN-20 (RGW) packages are available taped and reeled. Add R suffix to device type (e.g. UCD7230PWPR) to

order quantities of 2,000 devices per reel for the PWP package and 1,000 devices per reel for the RGW packages.

4