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Mechanical Data

7.1 Thermal Data for ZUT

7.1.1 Packaging Information

TMS320DM647/TMS320DM648

Digital Media Processor

SPRS372 – MAY 2007

The following table(s) show the thermal resistance characteristics for the ZUT mechanical package.

See Power Application Report.

Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZUT]

NO.

°C/W(1)

AIR FLOW (m/s)(2)

Junction-to-case

Junction-to-board

Junction-to-free air

PsiJT

Junction-to-package top

PsiJB

Junction-to-board

(1)

The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC

defined 1S2P system and will change based on environment as well as application.

For more information, see these three EIA/JEDEC standards:

•

EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)

•

EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

(2)

m/s = meters per second

The following packaging information and addendum reflect the most current data available for the

designated device(s). This data is subject to change without notice and without revision of this document.

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