Figure 10. Noise Reduction Techniques

Application and Implementation

NOTE

The following contents are the precautions for TMP112B recommended by UTD Semiconductor Co.,Limited .

in practical applications. Customers are responsible for determining suitability of components for their purposes.

Customers should validate and test their design implementation to confirm system functionality.

The TMP112B device requires pull-up resistors on the SCL, SDA, and ALERT pins, as shown in

Figure 9, the recommended value for the pull-up resistors is 5kΩ. In some applications the pull-up resistor can be

lower or higher than 5kΩ but must not exceed 3mA of current on any of those pins.

The TMP112B device is a very low-power device and generates very low noise on the supply bus.

Applying an RC filter to the V+ pin of the TMP112B device can further reduce any noise that the device might

propagate to other components. RF in Figure 10 must be less than 5kΩ and CF must be greater than 10nF.

Place the device in close proximity to the heat source that must be monitored, with a proper layout for good

Figure 9. Typical Connections of the TMP112B

thermal coupling. This placement ensures that temperature changes are captured within the shortest possible time

interval. To maintain accuracy in applications that require air or surface temperature measurement, take care to

isolate the package and leads from ambient air temperature. A thermally-conductive adhesive is helpful in achieving

accurate surface temperature measurement.

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