SMSC DS – USB97CFDC2-01

Page 24

Rev. 02-27-07

DATASHEET

11 MECHANICAL OUTLINE

FIGURE 9 - 100 PIN TQFP PACKAGE

MIN

NOMINAL

MAX

REMARK

A

~

~

1.60

Overall Package Height

A1

0.05

~

0.15

Standoff

A2

1.35

1.40

1.45

Body Thickness

D

13.80

14.00

14.20

X Span

D/2

6.90

7.00

7.10

D1

11.80

12.00

12.20

X body Size

E

13.80

14.00

14.20

Y Span

E/2

6.90

7.00

7.10

E1

11.80

12.00

12.20

Y body Size

H

0.09

~

0.20

Lead Frame Thickness

L

0.45

0.60

0.75

Lead Foot Length from Centerline

L1

~

1.00

~

Lead Length

e

0.40 Basic

Lead Pitch

θ

0

o

3.5

o

7

o

Lead Foot Angle

W

0.13

0.16

0.23

Lead Width

R1

0.08

~

~

Lead Shoulder Radius

R2

0.08

~

0.20

Lead Foot Radius

ccc

~

~

0.08

Coplanarity

Note 1: Controlling Unit: millimeter

Note 2: Minimum space between protrusion and an adjacent lead is .007 mm.

Note 3: Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm

Note 5: Details of pin 1 identifier are optional but must be located within the zone indicated.