AD8337BCPZ-R2 datasheet(24/24 Pages) AD

24 / 24 page

AD8337

Rev. B | Page 24 of 24

OUTLINE DIMENSIONS

EXPOSED

PAD

(BOTTOM VIEW)

0.50

BSC

0.60 MAX

PIN 1

INDICATOR

1.50

REF

0.50

0.40

0.30

2.75

BSC SQ

TOP

VIEW

12° MAX

0.70 MAX

0.65TYP

SEATING

PLANE

PIN 1

INDICATOR

0.90 MAX

0.85 NOM

0.30

0.23

0.18

0.05 MAX

0.01 NOM

0.20 REF

1.89

1.74

1.59

1.60

1.45

1.30

3.00

BSC SQ

EXPOSED PAD IS NOT CONNECTED INTERNALLY.

FOR INCREASED RELIABILITY OF THE SOLDER

JOINTS AND MAXIMUM THERMAL CAPABILITY IT

IS RECOMMENDED THAT THE PAD BE SOLDERED

TO THE GROUND PLANE.

Figure 79. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]

3 mm × 3 mm Body, Very Thin, Dual Lead

(CP-8-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

AD8337BCPZ-R21

−40°C to +85°C

8-Lead Lead Frame Chip Scale Package [LFCSP_VD]

CP-8-2

HVB

AD8337BCPZ-REEL1

−40°C to +85°C

8-Lead Lead Frame Chip Scale Package [LFCSP_VD]

CP-8-2

HVB

AD8337BCPZ-REEL71

−40°C to +85°C

8-Lead Lead Frame Chip Scale Package [LFCSP_VD]

CP-8-2

HVB

AD8337BCPZ-WP1

−40°C to +85°C

8-Lead Lead Frame Chip Scale Package [LFCSP_VD]

CP-8-2

HVB

AD8337-EVALZ1

Evaluation Board with Noninverting Gain Configuration

AD8337-EVAL-INV

Evaluation Board with Inverting Gain Configuration

AD8337-EVAL-SS

Evaluation Board with Single-Supply Operation

1 Z = Pb-free part.

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D05575-0-2/07(B)

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