ADFS7124-8BBCPZ datasheet(13/93 Pages) AD

13 / 93 page

Data Sheet

ADFS7124-8

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 13 of 93

TA = 25°C, unless otherwise noted.

Table 4. Absolute Maximum Ratings

Parameter

Rating

AVDD to AVSS

−0.3 V to +3.96 V

IOVDD to DGND

−0.3 V to +3.96 V

IOVDD to AVSS

−0.3 V to +5.94 V

AVSS to DGND

−1.98 V to +0.3 V

Analog Input Voltage to AVSS

−0.3 V to AVDD + 0.3 V

Reference Input Voltage to AVSS

−0.3 V to AVDD + 0.3 V

Digital Input Voltage to DGND

−0.3 V to IOVDD + 0.3 V

Digital Output Voltage to DGND

−0.3 V to IOVDD + 0.3 V

AINx/Digital Input Current

10 mA

Operating Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Maximum Junction Temperature

150°C

Lead Temperature, Soldering

Reflow

260°C

ESD Ratings

Human Body Model (HBM)

4 kV

Field-Induced Charged Device Model

(FICDM)

1250 V

Machine Model

400 V

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to the printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required. Thermal resistance values specified in

Table 5 are calculated based on JEDEC specifications and must

be used in compliance with JESD51-12. The worst-case junction

temperature is reported. The values in Table 5 are calculated based

on the standard JEDEC 2S2P thermal test board in a natural

convection test environment. Refer to the JEDEC JESD51 series.

Table 5. Thermal Resistance

Package Type θJA

θJB

θJC_TOP

Unit

32-Lead

LFCSP

40.6

17.2

°C/W

θJA is the natural convection, junction-to-ambient thermal resistance

measured in a one cubic foot sealed enclosure.

θJB is the junction-to-board thermal resistance.

θJC_TOP is the top junction-to-case thermal resistance.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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