CC1000-RTR2 datasheet(52/55 Pages) TI

52 / 55 page

CC1000

SWRS048A

Page 52 of 55

35. Ordering Information

Chipcon Part

Number*

TI Part Number

Description

Minimum Order

Quantity (MOQ)

CC1000-RTB1

CC1000PW

Single Chip RF Transceiver. CC1000,

TSSOP 28 package, RoHS compliant Pb-

free assembly in tubes with 50 pcs per tube.

250 (5 tubes of 50

units per tube)

CC1000-RTR1

CC1000PWR

Single Chip RF Transceiver. CC1000,

TSSOP 28 package, RoHS compliant Pb-

free assembly, T&R with 2500 pcs per reel.

2500 (tape and

reel)

CC1000-RWP2

CC1000YZ

Single Chip RF Transceiver. CC1000,

UltraCSP™ package, RoHS compliant Pb-

free assembly with 117 pcs per waffle pack.

585 (5 waffle

packs with 117

pcs per waffle

pack)

CC1000-RTR2

CC1000YZR

Single Chip RF Transceiver. CC1000,

UltraCSP™ package, RoHS compliant Pb-

free assembly, T&R with 2500 pcs per reel.

2500 (tape and

reel)

CC1000DK-433

CC1000 Development Kit, 433 MHz

CC1000DK-868-915

CC1000 Development Kit, 868/915 MHz

CC1000PPK-433

CC1000 Plug & Play Kit, 433 MHz

CC1000PPK-868

CC1000 Plug & Play Kit, 868/915 MHz

* Chipcon part numbers are obsolete, but included for reference. Use the TI part numbers when ordering parts.

36. General Information

36.1 Document Revision History

Revision

Date

Description/Changes

SWRS048A

January 2007

Reflow soldering temperature according to IPC/JEDEC J-STD-020C.

Max reflow temperature for CC1000 UltraCSP™ updated to 255 °C.

Added waffle pack specification.

Updated ordering information with TI part numbers.

Updated address information.

Updated header and footer.

Updated Important Notice.

Removed Chipcon specific Disclaimer, Trademarks and Life Support Policy

sections.

SWRS048

(2.3)

August 2005

UltraCSP™ package included

Minor corrections and editorial changes

2.2

April 2004

Shaping feature removed

Application circuit simplified

Additional information added for the demodulator

Additional information added for frequency calculation

Additional information added for calibration

Additional information added for crystal oscillator

Preliminary version removed

Narrow band information removed

REFDIV different in RX and TX

Minor corrections and editorial changes

36.2 Product Status Definitions

Data Sheet Identification

Product Status

Definition

Advance Information

Planned or Under

Development

This data sheet contains the design specifications for

product development. Specifications may change in

any manner without notice.

Preliminary

Engineering Samples

and First Production

This data sheet contains preliminary data, and

supplementary data will be published at a later date.

Chipcon reserves the right to make changes at any

time without notice in order to improve design and

supply the best possible product.

No Identification Noted

Full Production

This data sheet contains the final specifications.

Chipcon reserves the right to make changes at any

time without notice in order to improve design and

supply the best possible product.

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