The information contained herein is exclusive property of ATTEND. Do not copy and print except that Attend

accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-4 -

SOLDER ABILITY

Item

Requirement

Test Condition

Solderability

The surface of the portion

to be soldered shall at

least 95% covered

(EIA 364-52 )

After one hour steam aging.

The object of test procedure is to detail a unfirm

test methods for determining sim card connector

solderability.

The test procedure contained here utilizes the

solder dip technique. It is not intended to test or

evaluate solder cup, solder eyelet, other

hand-soldered type or SMT type terminations.

Resistance to

Soldering Heat

No mechanical defect on

housing or other parts.

1).for MANUAL SOLDERING:

Temperature

: 380 ± 10°C

Immersion duration : 3 ± 0.5 sec.

2).for REFLOW SOLDERING:

Pre-heat : 150(Min)~200(Max) °C,

60 ~180 Seconds

Temperature : 260 ± 5 °C

Immersion duration : 10~40 sec.