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STM32H7 bảng dữ liệu(PDF) 327 Page - STMicroelectronics

tên linh kiện STM32H7
Giải thích chi tiết về linh kiện  32-bit Arm® Cortex®-M7 480MHz MCUs, up to 2MB flash, up to 1MB RAM, 46 com. and analog interfaces
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
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STM32H7 bảng dữ liệu(HTML) 327 Page - STMicroelectronics

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DS12110 Rev 10
327/357
STM32H742xI/G STM32H743xI/G
Package information
348
integral heat slug. A distinguish feature is allowable on the bottom surface of the
package to identify the terminal A1 corner. Exact shape of each corner is optional.
9.
e represents the solder ball grid pitch.
10. N represents the total number of balls on the BGA.
11. Basic dimensions SD and SE are defined with respect to datums A and B. It defines the
position of the centre ball(s) in the outer row or column of a fully populated matrix.
12. Values in inches are converted from mm and rounded to 4 decimal digits.
13. Drawing is not to scale.
Figure 123. TFBGA100 - Footprint example
Table 220. TFBGA100 - Example of PCB design rules (0.8 mm pitch BGA)
Dimension
Values
Pitch
0.8
Dpad
0.400 mm
Dsm
0.470 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.400 mm
Stencil thickness
Between 0.100 mm and 0.125 mm
Pad trace width
0.120 mm
BGA_WLCSP_FT_V1
Dsm
Dpad



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