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STM32H7 bảng dữ liệu(PDF) 326 Page - STMicroelectronics |
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STM32H7 bảng dữ liệu(HTML) 326 Page - STMicroelectronics |
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326 / 357 page ![]() Package information STM32H742xI/G STM32H743xI/G 326/357 DS12110 Rev 10 Notes: 1. Dimensioning and tolerancing schemes conform to ASME Y14.5M-2018. 2. TFBGA stands for thin profile fine pitch ball grid array: 1.00 mm < A ≤ 1.20 mm / fine pitch e < 1.00 mm. 3. The profile height, A, is the distance from the seating plane to the highest point on the package. It is measured perpendicular to the seating plane. 4. A1 is defined as the distance from the seating plane to the lowest point on the package body. 5. Dimension b is measured at the maximum diameter of the terminal (ball) in a plane parallel to primary datum C. 6. BSC stands for BASIC dimensions. It corresponds to the nominal value and has no tolerance. For tolerances refer to form and position table. On the drawing these dimensions are framed. 7. Primary datum C is defined by the plane established by the contact points of three or more solder balls that support the device when it is placed on top of a planar surface. 8. The terminal (ball) A1 corner must be identified on the top surface of the package by using a corner chamfer, ink or metalized markings, or other feature of package body or Table 219. TFBGA100 - Mechanical data Symbol millimeters(1) inches(12) Min Typ Max Min Typ Max A(2)(3) - - 1.20 - - 0.0472 A1(4) 0.15 - - 0.0059 - - A2 - 0.74 - - 0.0291 - b(5) 0.35 0.40 0.45 0.0138 0.0157 0.0177 D8.00 BSC(6) 0.3150 BSC D1 7.20 BSC 0.2835 BSC E 8.00 BSC 0.3150 BSC E1 7.20 BSC 0.2835 BSC e(9) 0.80 BSC 0.0315 BSC N(11) 100 SD(12) 0.40 BSC 0.0157 SE(12) 0.40 BSC 0.0157 aaa 0.15 0.0059 ccc 0.20 0.0079 ddd 0.10 0.0039 eee 0.15 0.0059 fff 0.08 0.0031 |
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