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BFG10/X bảng dữ liệu(PDF) 2 Page - NXP Semiconductors |
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BFG10/X bảng dữ liệu(HTML) 2 Page - NXP Semiconductors |
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2 / 9 page ![]() 1995 Sep 22 2 Philips Semiconductors Product specification UHF power transistor BFG10W/X FEATURES • High efficiency • Small size discrete power amplifier • 900 MHz and 1.9 GHz operating areas • Gold metallization ensures excellent reliability. APPLICATIONS • Common emitter class-AB operation in hand-held radio equipment up to 1.9 GHz. DESCRIPTION NPN silicon planar epitaxial transistor encapsulated in a plastic, 4-pin dual-emitter SOT343 package. PINNING PIN DESCRIPTION 1 collector 2 emitter 3 base 4 emitter Fig.1 SOT343. Marking code: T5. fpage Top view MBK523 2 1 3 4 QUICK REFERENCE DATA RF performance at Tamb =25 °C in a common-emitter test circuit. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). THERMAL CHARACTERISTICS Note to the Limiting values and Thermal characteristics 1. Ts is the temperature at the soldering point of the collector pin. MODE OF OPERATION f (GHz) VCE (V) PL (mW) Gp (dB) ηc (%) Pulsed, class-AB, duty cycle: < 1 : 2; tp = 10 ms 1.9 3.6 200 ≥5 ≥50 Pulsed, class-AB, duty cycle: < 1 : 8; tp = 4.6 ms 0.9 6 650 ≥10 ≥50 0.9 6 360 ≥12.5 ≥50 SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter − 20 V VCEO collector-emitter voltage open base − 10 V VEBO emitter-base voltage open collector − 2.5 V IC collector current (DC) − 250 mA IC(AV) average collector current − 250 mA Ptot total power dissipation up to Ts = 102 °C; note 1 − 400 mW Tstg storage temperature −65 +150 °C Tj junction temperature − 175 °C SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-s thermal resistance from junction to soldering point up to Ts = 102 °C; note 1; Ptot = 400 mW 180 K/W |
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