603 Hardware Specifications

5

Table 2 provides the recommended operating conditions for the 603.

Table 3 provides the package thermal characteristics for the 603.

Table 4 provides the DC electrical characteristics for the 603.

Table 2. Recommended Operating Conditions

Characteristic

Symbol

Value

Unit

Core supply voltage

Vdd

3.135 to 3.465

V

PLL supply voltage

AVdd

3.135 to 3.465

V

Input voltage

Vin

–0.3 to 5.5

V

Die-junction temperature

Tj

0 to 105

°C

Notes: These are the recommended and tested operating conditions. Proper device operation outside of these

conditions is not guaranteed.

Table 3. Package Thermal Characteristics

Characteristic

Symbol

Value

Rating

Motorola wire-bond CQFP package die junction-to-case thermal resistance (typical)

θ

JC

2.2

°C/W

IBM C4-CQFP package die junction-to-heat sink base thermal resistance (typical)

θ

JS

1.1

°C/W

Note: Refer to Section 1.8, “System Design Information,” for more details about thermal management.

Table 4. DC Electrical Specifications

Vdd = 3.3

± 5% V dc, GND = 0 V dc, 0 ≤ T

j ≤ 105 °C

Characteristic

Symbol

Min

Max

Unit

Notes

Input high voltage (all inputs except SYSCLK)

VIH

2.2

5.5

V

Input low voltage (all inputs except SYSCLK)

VIL

GND

0.8

V

SYSCLK input high voltage

CVIH

2.4

5.5

V

SYSCLK input low voltage

CVIL

GND

0.4

V

Input leakage current, Vin = 3.465 V

Vin = 5.5 V

Iin

—10

µA1

Iin

—

TBD

µA1

Hi-Z (off-state) leakage current, Vin = 3.465 V

Vin = 5.5 V

ITSI

—10

µA1

ITSI

—

TBD

µA1

Output high voltage, IOH = –9 mA

VOH

2.4

—

V

AR

CH

IVE

D B

Y F

RE

ES

CA

LE

SE

MI

CO

ND

UC

TO

R,

INC

.