PDTA124E_SER

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 8 — 25 November 2011

4 of 17

NXP Semiconductors

PDTA124E series

PNP resistor-equipped transistors; R1 = 22 k

, R2 = 22 k

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Reflow soldering is the only recommended soldering method.

[3]

Device mounted on an FR4 PCB with 70

m copper strip line, standard footprint.

(1) SOT23; FR4 PCB, standard footprint

SOT883; FR4 PCB with 70

m copper strip line, standard footprint

(2) SOT323; FR4 PCB, standard footprint

(3) SOT416; FR4 PCB, standard footprint

Fig 1.

Power derating curves

Tamb (°C)

-75

175

125

25

75

-25

006aac778

100

200

300

Ptot

(mW)

0

(1)

(2)

(3)

Table 7.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Rth(j-a)

thermal resistance from junction

to ambient

in free air

PDTA124EE (SOT416)

[1][2] --

830

K/W

PDTA124EM (SOT883)

[2][3] --

500

K/W

PDTA124ET (SOT23)

[1] --

500

K/W

PDTA124EU (SOT323)

[1] --

625

K/W