January 28, 2014

16

IDTP9167

Advanced Datasheet

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The PCB design and layout can have a significant influence on the power dissipation capabilities of power management

ICs. This is due to the fact that the surface mount packages used with these devices rely heavily on thermally conductive

traces and planes to transfer heat away from the package. The following general guidelines will be helpful in designing a

board layout for low thermal resistance:

1. PC board traces with large cross sectional areas have higher thermal conductivity. If possible, a 2 oz copper ground

plane with ample thermal Vias connecting to the EPAD of the IDTP9167 is recommended.

2. Do not use solder mask or place silkscreen on the heat-dissipating traces/pads, as they increase the net thermal

resistance of the mounted IC package.

Recommended Board Layout

Figure 6 – Recommended board layout of one DPU