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DA7281-00FVC bảng dữ liệu(PDF) 82 Page - Renesas Technology Corp |
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DA7281-00FVC bảng dữ liệu(HTML) 82 Page - Renesas Technology Corp |
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82 / 88 page ![]() DA7281 LRA/ERM Haptic Driver with Multiple I²C Addresses, Integrated Waveform Memory, and Wideband Support Datasheet Revision 3.1 10-Feb-2022 CFR0011-120-00 82 of 87 © 2022 Renesas Electronics 7.3 Moisture Sensitivity Level The Moisture Sensitivity Level (MSL) is an indicator for the maximum allowable time period (floor lifetime) in which a moisture sensitive plastic device, once removed from the dry bag, can be exposed to an environment with a specified maximum temperature and a maximum relative humidity before the solder reflow process. The MSL classification is defined in Table 76. For detailed information on MSL levels refer to the IPC/JEDEC standard J-STD-020, which can be downloaded from http://www.jedec.org. The WLCSP package is qualified for MSL 1. The QFN package is qualified for MSL 3. Table 76: MSL Classification MSL Level Floor Lifetime Conditions MSL 4 72 hours 30 °C / 60 % RH MSL 3 168 hours 30 °C / 60 % RH MSL 2A 4 weeks 30 °C / 60 % RH MSL 2 1 year 30 °C / 60 % RH MSL 1 Unlimited 30 °C / 85 % RH 7.4 WLCSP Handling Manual handling of WLCSP packages should be reduced to the absolute minimum. In cases where it is still necessary, a vacuum pick-up tool should be used. In extreme cases plastic tweezers could be used, but metal tweezers are not acceptable, since contact may easily damage the silicon chip. Removal of a WLCSP package will cause damage to the solder balls. Therefore, a removed sample cannot be reused. WLCSP packages are sensitive to visible and infrared light. Precautions should be taken to properly shield the chip in the final product. 7.5 Soldering Information Refer to the IPC/JEDEC standard J-STD-020 for relevant soldering information. This document can be downloaded from http://www.jedec.org. |
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