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P9242-R bảng dữ liệu(PDF) 8 Page - Renesas Technology Corp |
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P9242-R bảng dữ liệu(HTML) 8 Page - Renesas Technology Corp |
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8 / 38 page ![]() P9242-R Datasheet © 2018 Integrated Device Technology, Inc 8 January 16, 2018 3. Absolute Maximum Ratings The absolute maximum ratings are stress ratings only. Stresses beyond those listed under “Absolute Maximum Ratings” might cause permanent damage to the P9242-R. Functional operation of the P9242-R at absolute maximum ratings is not implied. Exposure to absolute maximum rating conditions for extended periods could affect long-term reliability. Table 2. Absolute Maximum Ratings Pins[a] Rating[b] Units EN, VIN, SW_S, VBRG_IN, SW_BRG1, SW_BRG2, CSP, CSN, BST_BRG1, BST_BRG2, GH_BRG1, GH_BRG2 -0.3 to 28 V PREG, LDO33, VIN_LDO, LED1, LED2, VDDIO, SCL, SDA, ILIM/FOD, LED/Q-Fact, VCOIL, TS, BUZR, OVP_CTL, Q_DRV1, Q_DRV2, GL_BRG1, GL_BRG2, VDEM1, IDEMI, ISNS_OUT, DRV_VIN -0.3 to 6 V LDO18 -0.3 to 2 V [a] Absolute maximum ratings are not provided for reserved pins (RSV). These pins are not used in the application. [b] All voltages are referred to ground unless otherwise noted. All GND pins and the exposed pad (EP) connected together. Table 3. Package Thermal Information Symbol Description VFQFN Rating Units JA Thermal Resistance Junction to Ambient[a], [b], [c] 27.2 C/W JC Thermal Resistance Junction to Case [b], [c] 18.8 C/W JB Thermal Resistance Junction to Board[b], [c] 1.36 C/W TJ Operating Junction Temperature[a], [b] -40 to +125 C TA Ambient Operating Temperature[a], [b] -40 to +85 C TSTG Storage Temperature -55 to +150 C TLEAD Lead Temperature (soldering, 10s) +300 C [a] The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / θJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the device will enter thermal shutdown. [b] This thermal rating was calculated on a JEDEC 51-standard 4-layer board with the dimensions 76.2 x 114.3 mm in still air conditions. [c] Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables. Table 4. ESD Information Test Model Pins Ratings Units HBM All pins ±2000 V CDM All pins ±500 V |
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