STM32H7B3AI datasheet(201/238 Pages) STMICROELECTRONICS

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Table 134. LQFP144 - Mechanical data

Symbol

millimeters

inches(14.)

Min

Typ

Max

Min

Typ

Max

1.60

0.0630

A1(12.)

0.05

0.15

0.0020

0.0059

1.35

1.40

1.45

0.0531

0.0551

0.0571

b(9.)(11.)

0.17

0.22

0.27

0.0067

0.0087

0.0106

b1(11.)

0.17

0.20

0.23

0.0067

0.0079

0.0090

c(11.)

0.09

0.20

0.0035

0.0079

c1(11.)

0.09

0.16

0.0035

0.0063

D(4.)

22.00 BSC

0.8661 BSC

D1(2.)(5.)

20.00 BSC

0.7874 BSC

E(4.)

22.00 BSC

0.8661 BSC

E1(2.)(5.)

20.00 BSC

0.7874 BSC

0.50 BSC

0.0197 BSC

0.45

0.60

0.75

0.0177

0.0236

0.0295

1.00 REF

0.0394 REF

N(13.)

144

0°

3.5°

7°

0°

3.5°

7°

Θ1

0°

Θ2

10°

12°

14°

10°

12°

14°

Θ3

10°

12°

14°

10°

12°

14°

0.08

0.0031

0.08

0.20

0.0031

0.0079

0.20

0.0079

aaa

0.20

0.0079

bbb

0.20

0.0079

ccc

0.08

0.0031

ddd

0.08

0.0031

Notes:

Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.

The top package body size may be smaller than the bottom package size by as much as 0.15 mm.

Datums A-B and D to be determined at datum plane H.

To be determined at seating datum plane C.

Dimensions D1and E1 do not include mold flash or protrusions. Allowable mold flash or protrusions is “0.25

mm” per side. D1 and E1 are Maximum plastic body size dimensions including mold mismatch.

Details of pin 1 identifier are optional but must be located within the zone indicated.

All dimensions are in millimeters.

No intrusion allowed inwards the leads.

Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead

width to exceed the maximum “b” dimension by more than 0.08 mm. Dambar cannot be located on the lower

radius or the foot. Minimum space between protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5

mm pitch packages.

STM32H7B3xI

LQFP144 package information

DS13139 - Rev 8

page 201/238

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