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STM32H7B3AI bảng dữ liệu(PDF) 199 Page - STMicroelectronics

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STM32H7B3AI bảng dữ liệu(HTML) 199 Page - STMicroelectronics

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Table 133. WLCSP132 - Recommended PCB design rules
Dimension
Recommended values
Pitch
0.35 mm
Dpad
0,200 mm
Dsm
0.200 mm typ. (depends on soldermask registration tolerance)
Stencil opening
0.250 mm
Stencil thickness
0.080 mm
7.4.1
Device marking for WLCSP132
The following figure gives an example of topside marking versus pin 1 position identifier location.
The printed markings may differ depending on the supply chain.
Other optional marking or inset/upset marks, which depend on supply chain operations, are not indicated below.
Figure 93. WLCSP132 marking example (package top view)
H7B3QIY6Q
Y
WW
Product
identification(1)
Ball 1 indentifier
R
Revision code
Date code
1.
Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified
and therefore not approved for use in production. ST is not responsible for any consequences resulting
from such use. In no event will ST be liable for the customer using any of these engineering samples
in production. ST’s Quality department must be contacted prior to any decision to use these engineering
samples to run a qualification activity.
STM32H7B3xI
WLCSP132 package information
DS13139 - Rev 8
page 199/238



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