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HC705JJ7GRS/D bảng dữ liệu(PDF) 224 Page - NXP Semiconductors

tên linh kiện HC705JJ7GRS/D
Giải thích chi tiết về linh kiện  Low-Cost, HC05 Core MCU in 20-Pin Package (MC68HC705JJ7) or 28-Pin Package (MC68HC705JP7)
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nhà sản xuất  NXP [NXP Semiconductors]
Trang chủ  http://www.nxp.com
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HC705JJ7GRS/D bảng dữ liệu(HTML) 224 Page - NXP Semiconductors

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Mechanical Specifications
General Release Specification
MC68HC705JJ7/MC68HC705JP7 — Rev. 2.0
Mechanical Specifications
16.7 20-Pin Windowed Ceramic Integrated Circuit (Case 732)
16.8 28-Pin Windowed Ceramic Integrated Circuit (Case 733A)
NOTES:
1. LEADS WITHIN 0.010 DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONS A AND B INCLUDE MENISCUS.
DIM
MIN
MAX
INCHES
A
0.940
0.990
B
0.260
0.295
C
0.150
0.200
D
0.015
0.022
F
0.055
0.065
G
0.100 BSC
H
0.020
0.050
J
0.008
0.012
K
0.125
0.160
L
0.300 BSC
M
0
15
N
0.010
0.040
__
A
20
110
11
B
F
C
SEATING
PLANE
D
H
G
K
N
J
M
L
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
1.435
1.490
36.45
37.84
B
0.500
0.605
12.70
15.36
C
0.160
0.240
4.06
6.09
D
0.015
0.022
0.38
0.55
F
0.050
0.065
1.27
1.65
G
0.100 BSC
2.54 BSC
J
0.008
0.012
0.20
0.30
K
0.125
0.160
3.17
4.06
L
0.600 BSC
15.24 BSC
M
0
15
0
15
N
0.020
0.050
0.51
1.27
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B INCLUDE MENISCUS.
4. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
_
_
_
_
–A–
–T–
M
A
M
0.25 (0.010)
T
B
C
K
D
F
G
N
28 PL
14
1
15
28
L
J
M
SEATING
PLANE
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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