7.4 Thermal Information

THERMAL METRIC (1)

TLVM13610

UNIT

RDF

22 PINS

RθJA

Junction-to-ambient thermal resistance (TLVM13610EVM) (3)

18

°C/W

RθJA

Junction-to-ambient thermal resistance (JESD 51-7) (2)

25

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

12.8

°C/W

RθJB

Junction-to-board thermal resistance

7.4

°C/W

ΨJT

Junction-to-top characterization parameter

0.7

°C/W

ΨJB

Junction-to-board characterization parameter

7.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

3.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

The value of RΘJA given in this table is only valid for comparison with other packages and can not be used for design purposes.

These values were calculated in accordance with JESD 51-7, and simulated on a 4-layer JEDEC board. They do not represent the

performance obtained in an actual application. For example, the EVM RΘJA = 21.6 °C/W. For design information please see the

Thermal Design and Layout section.

(3)

Refer to the EVM User's Guide for board layout and additional information. For thermal design information please see the Thermal

Design and Layout section.

7.5 Electrical Characteristics

Limits apply over the recommended operating junction temperature range of -40°C to +125°C, unless otherwise noted.

Minimum and Maximum limits are specified through test, design or statistical correlation. Typical values represent the most

likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following

conditions apply: VIN = 12. VIN1 shorted to VIN2 = VIN. VOUT is output set point.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

SUPPLY VOLTAGE (VIN PIN)

VIN

Minimum operating input voltage

Needed to start up

3.7

V

Once Operating

3

V

VIN_OP_H

Minimum voltage hysteresis

1

V

IQ

Non-switching input current; measured

at VIN pin (3)

VFB = +5%, VBIAS = 5 V

0.5

10

µA

ISD

Shutdown quiescent current; measured

at VIN pin

VEN = 0 V, VIN = 12 V

0.57

7.5

µA

IB

Current into BIAS pin (not switching)

VFB = +5%, VBIAS = 5 V, Auto Mode

Enabled

18.5

26

µA

ENABLE (EN PIN)

VEN

Enable input-threshold voltage - rising

VEN rising

1.0

1.263

1.365

V

VEN_HYST

Enable threshold hysteresis

0.1

0.35

0.5

V

VEN_WAKE

Enable Wake-up threshold

0.4

V

IEN

Enable pin input current

VIN = VEN = 12 V

1.5

50

nA

INTERNAL LDO (VCC PIN)

VCC

Internal VCC voltage

VBIAS = 0V

3.4

V

VBIAS = 3.3 V, 20 mA

3.2

VCC_UVLO

VIN voltage at which Internal VCC under

voltage lock-out is released

IVCC = 0A

3.75

V

VCC_UVLO_HYST

Internal VCC under voltage lock-out

hysteresis

Hysteresis below VCC_UVLO

1.2

V

VOLTAGE REFERENCE (FB PIN)

VFB

Initial reference voltage accuracy for

adjustable (1 V FB) versions

VIN = 3.0 V to 36 V, FPWM Mode

0.985

1

1.015

V

TLVM13610

SLVSH63 – FEBRUARY 2023

www.ti.com

6

Submit Document Feedback

Copyright © 2023 Texas Instruments Incorporated

Product Folder Links: TLVM13610