standard type are for T

+125˚C. Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent

the most likely parametric norm at T

Symbol

Parameter

Conditions

Min

Typ

Max

Units

θ

JA

Junction to Ambient

0 LFPM Air Flow (Note 3)

LLP-6 Package

80

˚C/W

SOT23-5 Package

118

θ

JC

Junction to Case (Note 3)

LLP-6 Package

18

˚C/W

SOT23-5 Package

80

T

SD

Thermal Shutdown Temperature

165

˚C

Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Range indicates conditions for which the device is

intended to be functional, but does not guarantee specfic performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics.

Note 2: Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device.

Note 3: Applies for packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air.

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