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MCP9600TE/MX bảng dữ liệu(PDF) 51 Page - Microchip Technology

tên linh kiện MCP9600TE/MX
Giải thích chi tiết về linh kiện  Thermocouple EMF to Temperature Converter, ±1.5°C Maximum Accuracy
PDF  57 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP9600TE/MX bảng dữ liệu(HTML) 51 Page - Microchip Technology

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 2015-2021 Microchip Technology Inc.
DS20005426G-page 51
MCP960X/L0X/RL0X
RECOMMENDED LAND PATTERN
Microchip Technology Drawing C04-186B
20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body
SILK SCREEN
1
2
20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
C1
Optional Center Pad Width
Contact Pad Spacing
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
C2
Y2
X2
3.35
3.35
MILLIMETERS
0.65 BSC
MIN
E
MAX
4.50
4.50
Contact Pad Length (X20)
Contact Pad Width (X20)
Y1
X1
0.55
0.40
G
Distance Between Pads
0.20
NOM
[MQFN] - (Also called VQFN)
C1
C2
EV
EV
E
X2
Y2
ØV
G
Y1
X1



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