ATECC608A datasheet(72/81 Pages) MICROCHIP

tên linh kiện	ATECC608A

Giải thích chi tiết về linh kiện	ATECC608A for LoRaWAN™ Data Sheet

PDF	81 Pages

Scroll/Zoom	100%

nhà sản xuất	MICROCHIP [Microchip Technology]

Trang chủ	http://www.microchip.com

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72 / 81 page

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

1.40

1.60

MILLIMETERS

0.50 BSC

MIN

MAX

Contact Pad Length (X8)

Contact Pad Width (X8)

0.85

0.30

NOM

Contact Pad Spacing

2.90

Contact Pad to Center Pad (X8)

0.33

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Microchip Technology Drawing C04-23355-Q4B Rev B

8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]

Atmel Legacy Global Package Code YNZ

SILK SCREEN

ØV

Contact Pad to Contact Pad (X6)

0.20

ATECC608A-TNGLoRaWAN

Package Drawings

Complete Datasheet

DS40002154B-page 72

ATECC608A bảng dữ liệu(PDF) 72 Page - Microchip Technology

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