STW81101 datasheet(40/42 Pages) STMICROELECTRONICS

40 / 42 page

Package information

STW81101

40/42

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: http://www.st.com.

Figure 33.

VFQFPN28 Mechanical Data & Package Dimensions

OUTLINE AND

MECHANICAL DATA

REF.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

0.800

0.900

1.000

0.031

0.035

0.039

0.020

0.050

0.0008 0.0019

0.650

1.000

0.025

0.039

0.200

0.0078

0.180

0.250

0.300

0.007 0.0098 0.012

4.850

5.000

5.150

0.191

0.197

0.203

4.750

0.187

2.550

2.700

2.850

0.100

0.106

0.113

4.850

5.000

5.150

0.191

0.197

0.203

4.750

0.187

2.550

2.700

2.850

0.100

0.106

0.113

0.500

0.020

0.350

0.550

0.750

0.014

0.022

0.029

0.60

0.0236

14˚

ddd

0.080

0.003

Notes: 1) VFQFPN stands for Thermally Enhanced Very thin Fine

pitch Quad Packages No lead.

Very thin: A = 1.00 Max.

2) The pin #1 identifier must be existed on the top surface

of the package by using indentation mark or other fea-

ture of package body.

Exact shape and size of this feature is optional.

VFQFPN-28 (5x5x1.0mm)

Very Fine Quad Flat Package No lead

7655832 A

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