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L99MOD53XP bảng dữ liệu(PDF) 7 Page - STMicroelectronics

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DS12617 Rev 5
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L99MOD53XP
Block diagram and pin description
34
Figure 2. Configuration diagram (top view)
OUT4
NC
GND 1
OUT8 2
OUT1 3
4
5
DI
6
CM / PWM2
7
8
DO
9
Vcc
10
11
Vs
12
Vs
OUT4
14
Vs
15
Vs
16
17
18
GND
36
OUT6
35
NC
34
OUT8
33
32
PWM1
31
NC
30
29
CP
28
Vs
27
NC
26
Vs
25
NC
24
OUT5
23
OUT5
22
GND
21
Vs
20
OUT7
19
Vs
OUT3
OUT2
CSN
GND
13
CLK
PowerSSO-36
Table 2. Pin definitions and functions
Pin
Symbol
Function
1, 18, 19, 36
GND
Ground:
reference potential.
Important: for the capability of driving the full current at the outputs all pins of
GND must be externally connected.
2, 35
OUT8
High-side-driver-output 8
The output is built by a high-side switch and is intended for resistive loads, hence
the internal reverse diode from GND to the output is missing. For ESD reason a
diode to GND is present but the energy which can be dissipated is limited. The
high-side driver is a power DMOS transistor with an internal parasitic reverse
diode from the output to VS (bulk-drain-diode). The output is over-current and
open-load protected.
Important: for the capability of driving the full current at the outputs both pins of
OUT8 must be externally connected.
3
4
5
OUT1 OUT2
OUT3
Half-bridge-output 1,2,3
The output is built by a high-side and a low-side switch, which are internally
connected. The output stage of both switches is a power DMOS transistor. Each
driver has an internal parasitic reverse diode (bulk-drain-diode: high-side driver
from output to VS, low-side driver from GND to output). This output is over-
current and open-load protected.



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