Symbol

Parameter

Min

Typ

Max

Unit

SS89

Squib high-side supply channel 8 and 9

-0.3

-

40

V

SR9

Squib low-side channel 9

-0.3

-

35

V

SG89

Squib low-side ground channel 8 and 9

-0.3

-

0.3

V

SR8

Squib low-side channel 8

-0.3

-

35

V

SF8

Squib high-side channel 8

-1(4)

-

40

V

VSF1_S

Safing FET regulator 1 source input

-0.3

-

40

V

VSF1_G

Safing FET regulator 1 gate output

-0.3

-

40

V

V5_SENSE

V5 regulator sense input

-0.3

-

40

V

V5_DRV

V5 regulator drive output

-0.3

-

40

V

ACL

End-of-life disposal control input

-0.3

-

40(6)

V

SYSBSTSW

System boost switching output

-0.3

-

40

V

BSTGND

Boost regulator ground

-0.3

-

0.3

V

ERBSTSW

Energy reserve boost switching output

-0.3

-

40

V

Ex Pad Down

Substrate ground (backside)

-0.3

-

0.3

V

1. Or 20 mA for 10 ms during transient.

2. Valid in transient conditions only.

3. Set at 20 V for pin FMEA constraints.

4. In the case of deployment turn off the transient voltages on SS and SF pins can move away from each other until a

maximum voltage of SS-SF < 45 V for a limited transient time (6.5 μs maximum) with no damage on device. Additionally in

this time transient, in worst case load condition (maximum load inductance 56 μH) the peak energy that can be handled by

the ESD protection on SF pin is 128 μJ within a maximum time of 6.5 μs.

5. Valid for TJ > 27 deg, otherwise -18 V.

6. Set at 40 V for pin FMEA constraints.

Table 3. ESD protection

Symbol

Parameter

Min

Typ

Max

Unit

All pins

HBM

-2

-

2

kV

All pins

CDM (values for corner pins in brackets)

-500/(-750)

-

500/(750)

V

Global pins (except LIN)

HBM

-4

-

4

kV

LIN pin

HBM

-6

-

6

kV

L9691

Absolute maximum ratings

DB4803 - Rev 2

page 11/24