Tr i p ath Technol ogy, I n c. - Techni cal I n for m ati on

11

TLD4012 – JB/Rev. 2.0a/05.02

APPLICATION INFORMATION

Power D i ssipation D e rating for 5x5mm TQFP with Exposed D i e Pad

For operating at ambient temperatures above 25

based on a 150

Where

(Copper Pad Soldered To PCB)

Airflow

(LFPM)

5x5mm

0

34.5

200

29.1

500

27.2

Values apply when the exposed pad is soldered to a JEDEC standard test board.

supplies.

The TLD4012 incorporates an exposed die pad on the underside of its package. This acts as a heat sink

and should be connected to a copper plane on the printed circuit board for optimum heat dissipation. This

copper plane must be connected to VSS15.