AM2182

Motor Driver IC

A

s

M

1

- 5 -

1

REV

FWD

POWER

SAVE

PREVCC

(PRE)

POWVCC

OUTPUT PRE / VOM

COMPENSATION

FUNCTION

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

TSD

8V

8V

PS

REV

FWD

SET

M

θja junction-to-ambient thermal resistance

35.51℃/W

Ψjt junction-to-top characterization parameter 0.53℃/W



Θja is obtained in a simulation on a JEDEC-standard 2s2p board as specified

inJESD-51.



The

Θja number listed above gives an estimate of how much temperature rise is

expected if the device was mounted on a standard JEDEC board.



When mounted on the actual PCB, the

Θja value of JEDEC board is totally different than

the

Θja value of actual PCB.



Ψjt is extracted from the simulation data to obtain Θja using a procedure described in

JESD-51, which estimates the junction temperature of a device in an actual PCB.



The thermal characterization parameter,

Ψjt, is proportional to the temperature

difference between the top of the package and the junction temperature. Hence, it is

useful value for an engineer verifying device temperature in an actual PCB environment

as described in JEDEC JESD-51-12.



When Greek letters are not available,

Ψjt is written Psi-jt.



Definition: