AM2182

Motor Driver IC

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The thermally enhanced ETSSOP package is based on the 20-pin ETSSOP, but includes a

thermal pad (see Figure 7) to provide an effective thermal contact between the IC and the

PCB. The Thermal-pad package (thermally enhanced ETSSOP) combines fine-pitch,

surface-mount technology with thermal performance comparable to much larger power

packages. The Thermal-pad package is designed to optimize the heat transfer to the PCB.

Because of the small size and limited mass of an ETSSOP package, thermal enhancement is

achieved by improving the thermal conduction paths that remove heat from the component.

The thermal pad is formed using a lead-frame design and manufacturing technique to provide

a direct connection to the heat-generating IC. When this pad is soldered or otherwise

thermally coupled to an external heat dissipater, high power dissipation in the ultra-thin,

fine-pitch, surface-mount package can be reliably achieved.

The thermal design for the ETSSOP part (e.g., thermal pad soldered to the board) should be

similar to the design in the following figures. The cooling approach is to conduct the

dissipated heat into the via pads on the board, through the vias in the board, and into a

heat-sink (aluminum bar) (if necessary).Figure 7 shows a recommended land on the PCB.

Figure 7 Recommended Via holes placement