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L6711 bảng dữ liệu(PDF) 27 Page - STMicroelectronics |
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L6711 bảng dữ liệu(HTML) 27 Page - STMicroelectronics |
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27 / 38 page ![]() 27/38 L6711 mosfet of that phase until IINFOx re-cross the threshold or until the next clock cycle. This implies that the device limits the peak of the inductor current. In any case, the inductor current won't overcome the IOCPx value and this will represent the maximum peak value to consider in the OC design. The device works in Constant-Current, and the output voltage decreases as the load increase, until the output voltage reaches the UVP threshold. When this threshold is crossed, all mosfets are turned off, the FAULT pin is driven high and the device stops working. Cycle the power supply or the OUTEN pin to re- start operation. The transconductance resistor Rg can be designed considering that the device limits the inductor current ripple peak. Moreover, when designing D-VID systems, the additional current due to the output filter charge during dynamic VID transitions must be considered. where 14 OSCILLATOR The internal oscillator generates the triangular waveform for the PWM charging and discharging with a constant current an internal capacitor. The switching frequency for each channel, FSW, is internally fixed at 150kHz so that the resulting switching frequency at the load side results in being tripled. The current delivered to the oscillator is typically 25 µA (corresponding to the free running frequency Fsw=150kHz) and it may be varied using an external resistor (ROSC) connected between the OSC pin and SGND or VCC (or a fixed voltage greater than 1.24V). Since the OSC pin is fixed at 1.24V, the frequency is varied proportionally to the current sunk (forced) from (into) the pin considering the internal gain of 6KHz/ µA. In particular connecting ROSC to SGND the frequency is increased (current is sunk from the pin), while connecting ROSC to VCC=12V the frequency is reduced (current is forced into the pin), according to the following relationships: Maximum programmable switching frequency depends on the Current Reading Method selected. When reading across LS mosfet, the maximum switching frequency per phase must be limited to 500kHz to avoid current reading errors causing, as a consequence, current sharing errors. When reading across the inductor, higher switching frequency can be approached (device power dissipation must be checked prior to design high switching frequency systems). Figure 20. ROSC vs. Switching Frequency Rg I OCPx max () RSENSE max () ⋅ I OCTH min () ----------------------------------------------------------------------- = I OCPx I OUT OCP () 3 ---------------------------- I PP ∆ 2 ------------ I D-VID 3 --------------- ++ = R OSC vs. GND: FSW 150kHz 1.237 R OSC kΩ () ----------------------------- 6 kHz µA ----------- ⋅ + 150kHz 7.422 10 6 ⋅ R OSC k Ω () ----------------------------- + == R OSC vs. 12V: FSW 150 kHz 12-1.237 R OSC kΩ () ----------------------------- 6 kH z µA ----------- ⋅ + 150kHz 6.457 10 7 ⋅ R OSC k Ω () ----------------------------- + == 0 2000 4000 6000 8000 10000 12000 14000 25 50 75 100 125 150 0 200 400 600 800 1000 150 250 350 450 550 650 750 850 ROSC [k Ω] to 12V vs. Selected FSW [kHz] ROSC [k Ω] to SGND vs. Selected FSW [kHz] |
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