DDA002C

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5

Maximum Ratings

Symbol

Rating

Value

Unit

Continuous voltage on the bridge pin, pin 17

−1 to 600

V

Maximum injected charge into the HB pin (Note 3)

11

nC

Floating supply voltage, pin 17 and 19

−0.3 to 20

V

High side output voltage, pin 18

VHB−0.3 to

VBOOT+0.3

V

Low side output voltage, pin 15

−0.3 to Vcc+0.3

V

Maximum slew rate on the HB pin, pin 17

±50

V/ns

Vcc

Power Supply voltage, pin 16

−0.3 to 20

V

pin voltage, all pins (except pin 3, 6, 15, 16, 17, 18, and 19)

−0.3 to 10

V

Synchronous clamp pin voltage, pin 3

−0.3 to 5

V

Maximum frequency adjust pin voltage, pin 6

−0.3 to 5

V

Thermal Resistance Junction−to−Ambient,

Thermal Resistance Junction−to−Ambient,

(Soldered on recommended layout, 1 oz copper)

137

117

°C/W

Storage Temperature Range

−60 to +150

°C

Maximum Junction Temperature

+150

°C

ESD Capability, HBM model (Except all HV pins i.e., HB, Hgd and Boot) (Note 1)

2

kV

ESD Capability, Machine Model

200

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per JEDEC (22A114C − Human

Body Model and 22A115A Machine Model)

2. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78.

3. The maximum injected charge corresponds to the injected current integrated over time into the half−bridge pin. Please refer to Figure 60

and related notes.