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ADP2450ASTZ-3-R7 bảng dữ liệu(PDF) 9 Page - Analog Devices

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ADP2450ASTZ-3-R7 bảng dữ liệu(HTML) 9 Page - Analog Devices

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Data Sheet
ADP2450
Rev. B | Page 9 of 40
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
VIN, SW, DET, VPTH
−0.3 V to +40 V
AVDD
−0.3 V to +6 V
BST
The SW pin voltage (VSW) + 6 V
DRV
−0.3 V to +12 V
EIN1, EIN2, EIN3, EIN4
−8 V to +8 V
EIN5_P, EIN5_N
−8 V to +8 V
EOUT1, EOUT2, EOUT3, EOUT4,
EOUT5, VCOM, RCOM
−0.3 V to VAVDD
VREG, FB1, FB2, VTRP, VTRPL,
RSTO, TRG, GATE, GAIN0,
GAIN1
−0.3 V to +6 V
PGNDx to GND
−0.3 V to +0.3 V
Operating Temperature Range
(Junction)
−40°C to +125°C
Storage Temperature Range
−65°C to +150°C
Soldering Conditions
JEDEC J-STD-020
Electrostatic Discharge (ESD)
Human Body Mode
4000 V (for EIN1, EIN2, EIN3,
EIN4, EIN5_P, and EIN5_N pins),
2000 V (for the rest of pins)
Charged Device Mode
500 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Close attention to
PCB thermal design is required.
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure.
θJC is the junction to case thermal resistance.
Table 6. Thermal Resistance
Package Type
θJA
θJC
Unit
CP-32-71
32.7
1.4
°C/W
ST-481
66.68
3.41
°C/W
1 θJA is measured using natural convection on a JEDEC 4-layer board with the
exposed pad soldered to the PCB and with thermal vias.
ESD CAUTION



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