PPC5604BAMLL4R datasheet(56/109 Pages) NXP

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MPC5604B/C Microcontroller Data Sheet, Rev. 15

Package pinouts and signal descriptions

NXP Semiconductors

Example 2. Simplified regulator

The regulator should be able to provide significant amount of the current during the standby exit process.

For example, in case of an ideal voltage regulator providing 200 mA current, it is possible to recalculate

the equivalent ESRSTDBY(MAX) and CSTDBY(MIN) as follows:

ESRSTDBY(MAX) = |ΔVDD(STDBY)|/(IDD_BV − 200 mA) = (30 mV)/(100 mA) = 0.3 Ω

CSTDBY(MIN) = (IDD_BV − 200 mA)/dVDD(STDBY)/dt = (300 mA − 200 mA)/(15 mV/µs) = 6.7 µF

In case optimization is required, CSTDBY(MIN) and ESRSTDBY(MAX) should be calculated based on the

regulator characteristics as well as the board VDD plane characteristics.

2.17.2

Low voltage detector electrical characteristics

The device implements a Power-on Reset (POR) module to ensure correct power-up initialization, as well

as four low voltage detectors (LVDs) to monitor the VDD and the VDD_LV voltage while device is supplied:

•

POR monitors VDD during the power-up phase to ensure device is maintained in a safe reset state

(refer to RGM Destructive Event Status (RGM_DES) Register flag F_POR in device reference

manual)

•

LVDHV3 monitors VDD to ensure device reset below minimum functional supply (refer to RGM

Destructive Event Status (RGM_DES) Register flag F_LVD27 in device reference manual)

•

LVDHV5 monitors VDD when application uses device in the 5.0 V ± 10% range (refer to RGM

Functional Event Status (RGM_FES) Register flag F_LVD45 in device reference manual)

•

LVDLVCOR monitors power domain No. 1 (refer to RGM Destructive Event Status (RGM_DES)

•

LVDLVBKP monitors power domain No. 0 (refer to RGM Destructive Event Status (RGM_DES)

NOTE

When enabled, power domain No. 2 is monitored through LVDLVBKP.

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