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2018 - 2022 Microchip Technology Inc. and its subsidiaries

DS20006080B-page 15

MIC5376/7/8

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

3.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

E2

A3

e

L

E

N

0.65 BSC

0.152 REF

0.45

0.20

0.175

0.50

0.00

0.225

0.25

0.50

0.55

0.02

1.00 BSC

MILLIMETERS

MIN

NOM

4

0.55

0.30

0.275

0.60

0.05

MAX

Overall Length

Exposed Pad Length

D

D2

0.45

1.00 BSC

0.50

0.55

Microchip Technology Drawing C04-1149 Rev A Sheet 2 of 2

4-Lead Ultra Thin Plastic Dual Flat, No Lead Package (HCA) - 1x1 mm Body [UDFN]